<img src="https://fdn.gsmarena.com/imgroot/news/26/05/samsung-exynos-2700-sbs-packaging-tech/-184x111/gsmarena_00.jpg" width="184" height="111" hspace="3" alt="" border="0" align=left style="background:#333333;padding:0px;margin:0px 4px 0px 0px;border-style:solid;border-color:#aaaaaa;border-width:1px" /> <p>Samsung’s next-generation flagship chipset, the Exynos 2700, could adopt a new packaging design, according to a recent report. The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC.
Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has used since the Exynos 2400, reportedly helped improve thermal performance. However, the technology is said to have been less profitable for the company due to its complex and costly manufacturing process.
According to the report, which cites an industry official, Samsung plans to...</p> May 16, 2026 at 03:01AMvia GSMArena.com - Latest articles https://ift.tt/skH4e0g
ليست هناك تعليقات:
إرسال تعليق