Smartphone chipsets keep getting faster year after year, but despite continued improvement in silicon nodes, they keep running hotter too. This is why cooling solutions have become a major factor with vapor chambers (aka heat pipes) being a common part of the cooling stack. Xiaomi has developed the Loop LiquidCool technology that improves on basic heat pipes in two ways and the result is double the cooling efficiency. This technology is expected to appear in Xiaomi products in the second half of 2022. Here’s how it works (look at the chart above). Heat from the chipset causes liquid...
November 05, 2021 at 01:35PMvia GSMArena.com - Latest articles https://ift.tt/3k8X0kP
ليست هناك تعليقات:
إرسال تعليق