The first phone with a Snapdragon 888 chipset is already official with the launch of Xiaomi’s Mi 11 yesterday in China. The brand new Xiaomi flagship has quickly made its way to local tech bloggers and teardown experts Aiao Technology decided to take it apart and show us what it looks like on the inside. As with all teardowns this one starts by removing the SIM tray located on the bottom near the USB-C port. Then it's time to pry open the plastic eco-leather back free from all the adhesive and remove a few screws holding the camera sensor cover. The main 108MP sensor is Samsung's...
December 29, 2020 at 11:51AMvia GSMArena.com - Latest articles https://ift.tt/2WSldzL
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